Major Changes in Optical Module Forms
Form Factors:OSFP and QSFP-DD have emerged as the dominant form factors, with OSFP providing better thermal performance and QSFP-DD offering backward compatibility. Coherent technology facilitates long-distance, high-speed transmission with exceptional signal quality. Lasers: DFB (Distributed Feedback) lasers or VCSEL (Vertical Cavity Surface Emitting Lasers) for short reach Modulators: Silicon photonic Mach-Zehnder modulators or electro-absorption modulators Photodetectors: Germanium-on-silicon PIN or APD photodetectors DSP: 7nm or 5nm CMOS process nodes. Building on the 400G foundation, advancements in optical communication technologies, such as DSP (Digital Signal Processing) and multi-channel design, have increased data process capacity and network bandwidth, accelerating the commercialization and large-scale deployment of 800G transceivers. We'll examine Linear Pluggable Optics (LPO) and Linear Receive Optics (LRO) as cost-effective, low-power alternatives, discuss advanced cooling solutions tackling the heat challenges of high-speed modules, and explore game-changing paradigms like Co-Packaged Optics (CPO), Optical Input/Output. The Development Path of Optical Modules has shaped every major stage of digital communication. Over time, this path has become clear through improvements in size, speed, modulation, and integration density.
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