Infineon unveils high density power modules to enable
Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total
Read MoreInfineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total
Read MoreOur portfolio offers scalable and innovative power module solutions to optimize energy management, simplify system design and accelerate product
Read MoreInfineon Technologies AG has launched the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high
Read MoreQFN modules offer high power density and strong performance features that make them a well-rounded choice for many applications. There are two popular package configurations in the QFN module
Read MoreThe Scholl Chair team analyzes the latest update to U.S. advanced semiconductor export controls, which come a year after the seismic policy shift of the October 7 rules.
Read MoreThe race for compact, efficient, and reliable power electronics is accelerating—and Microchip is responding with a new lineup of DualPack 3
Read MoreIEEE Article High-current-density power modules mitigate the environmental impact of power-intensive genAI Learn how advanced high-current-density power
Read MoreThese modules enable true vertical power delivery (VPD) and offer industry''s best current density of 1.6 A/mm 2. They follow the TDM2254xD dual-phase power modules introduced by
Read MoreMentioning: 3 - Advanced packaging technologies like wafer-level fan-out and 3-D system-in-package (3-D SIP) are rapidly penetrating the market of electronic components. For cost reduction, one
Read MoreThis Guidebook outlines the advance design approaches and manufacturing processes needed to design the most complex of these PWBs, the
Read MoreWe design and build a wide range of power modules with superior characteristics such as low stray inductance values and fast switching times using Si IGBT and SiC MOSFET technologies.
Read MoreStarting from 2013, TEC Microsystems GmbH provides complete analysis, development and manufacturing of thermoelectric modules for Small Scale
Read MoreThe paper represents further progress in the development of short-legged thermoelectric (TE) micro modules for cooling high power density electronic components. Theoretical analysis and
Read MoreThis paper describes the development of low cost 3-D packaging of transmit/receive (T/R) modules for an active array radar at X-band. The development focused on the design,
Read MoreMicrochip offers a wide range of DC-DC power modules with input voltages from 5.5-70V, available in ultra-compact, rugged and thermally
Read MoreThe research conducted by the University of Arkansas represents a significant stride forward in the domain of custom, high-density power modules for electric vehicle and other high-voltage applications.
Read MoreBoth techniques enable miniaturization and high integration density [14, 15]. Based on actual application requirements, this work utilizes a DDR3 die with a storage capacity of 1 GB and a
Read MoreInfineon Technologies AG announced the strengthening of its existing collaboration with Delta Electronics, Inc., in the development of state-of-the-art high-density power modules capable of
Read MoreEarly 2026: Several module suppliers introduced integrated cooling baseplate designs, improving thermal resistance by 10–14%, strengthening competitive differentiation within the High Density
Read MoreFull Silicon Carbide (SiC) MOSFET modules have clear performance benefits, especially where high power density is required, but how to achieve the highest possible power density?
Read MoreMulti-phase power modules are critical to meet the power demands of high-power GPU systems by providing high power density and best-in-class efficiency without compromising power integrity.
Read MoreGain in-depth insights into High Density Monocrystalline Cell Modules Market, projected to surge from USD 15.67 billion in 2024 to by 2033, expanding
Read MoreMicrochip''s latest power module targeting AI systems includes integrated I2C and PMBus interfaces for flexible configuration and monitoring.
Read MoreThese modules can provide an entire power subsystem within a single high-power, multichip package. There are several reasons why this type of integration has not been easily
Read MoreFlex technology special features are high reliability, high packing density and good mechanical stability. Together with Flip-Chip and COB techniques, high-density
Read MoreMicrodul is specialized in manufacturing high-quality, miniature electronic modules and in the processing of uncased integrated circuits.
Read MoreHeterogenous Integration using Fan-out Wafer-level Packaging (FOWLP) Technology to Produce High Performance and Low-Cost Multi-Chip Modules Cliff Sandstrom Deca Technologies Inc.
Read MoreWhile the ultimate integration level is an integrated circuit, often the right miniaturisation for a product is a high density module or particularly a combination
Read MoreDiscover Micron''s high-performance, reliable DRAM modules for versatile memory solutions across computing and enterprise applications.
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