Co-packaged Photonics Intelligent
Home / Co-packaged Photonics Intelligent
By integrating optical engines closer to switch ASICs and GPUs through advanced packaging approaches such as 2. Co-packaged optics (CPO) technology, a key enabler for next-generation data center architectures, promises unprecedented bandwidth density and power efficiency by tightly integrating optical engines with switch silicon. This paper explores the evolution of CPO performance from various perspectives, including fan-out wafer level. This technology can immediately boost today's AI/ML compute power to train larger neural networks that can perform more complex tasks. As trillion‑parameter models scale across thousands of GPUs, the limits of electrical interconnects are no longer theoretical; they are active barriers to system performance, energy efficiency, and operational cost. At the 22nd IMAPS Device Packaging Conference (DPC 2026), held March 2–5, 2026, in.