Interfacing silicon photonics for high-density co
In this article we focus on the optical interfacing challenges for high-density co-packaged optics (CPO) applications, where assembly yield and scalability are
Read MoreSilicon Photonics Module Coupling System
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There are mainly two categories of fiber-to-chip optical coupling: off-plane coupling and in-plane coupling. Silicon photonics has drawn increasing attention in the past few decades and is a promising key technology for future daily applications due to its various merits including ultra-low cost, high integration density owing to the high refractive index of silicon, and compatibility with current. At FormFactor, our engineers have collaborated with IHP Microelectronics to develop the industry's first fully automated wafer-level edge coupling measurement system designed specifically for silicon photonic integrated circuits (PICs). The collaborations serve to integrate various software platforms and capabilities into TSMC's platform.