For board-to-board or even chip-to-chip optical interconnects, electro-optical circuit boards (EOCB) are needed to enable compact and power eficient future data communication systems.
Read MoreEOCB-platform for integrated photonic chips direct-on-board assembly within Tb/s applications IEEE 68th Electronic Components and Technology Conference (ECTC) Proceedings of
Read MoreThe overall objective is to examine the feasibility of electrical-optical printed circuit boards and to assess their use in various application areas (automotive engineering, computer technology).
Read MoreBasis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined.
Read MoreGlass waveguides fabricated by ion-exchange are a promising technology for short reach on-board optical interconnects. We developed an optical connector concept for the interconnection of
Read MoreThe manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced
Read MoreCompact on‐board transceivers located very close to the compute nodes are a crucial aspect of this optical multi‐socket board approach. They convert signals between the electrical and optical
Read MoreThe commercial adoption of electro-optical printed circuit board (EOCB) technology will be accelerated by the development of industrial and conformity standards for high volume fabrication,
Read MoreThe concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets
Read MoreThe concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets (display glass)
Read MoreEfficient packaging of integrated photonic chips (PIC) on host substrates is essential to fully deploy their potential and to co-integrate electronic chips (EIC). A high-performance electro-optical printed circuit
Read MoreOptical signal routing is realized by embedded board-level waveguides, the so-called electro-optical printed circuit board (EOCB). Chip-on-board (COB)
Read MorePhotonic system integration technologies PCB level: EOCB, integrated optical waveguides, lamination, assembly of connectors Interposer level: lens arrays, (TGV, soldering, thin film) Interconnection
Read MoreThe concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets (display glass) are presented.
Read MoreDie Kombination aus elektrischen und optischen Lagen in einer Leiterplatte oder einem Chip bietet Lösungen für die genannten Probleme an. Das Fraunhofer IZM
Read MoreChip‐on‐board silicon photonics O‐band wavelength‐division multiplexing transceivers have been developed that will eventually enable high‐throughput on‐board optical communication for
Read MoreCurrently, he is leading the team EOCB at Fraunhofer IZM, researching on electrical optical circuit boards made of glass. His research
Read MoreMission Statement Development of production technologies for electro-optical printed circuit boards (EOCB) and optical solutions Manufacturing of electro-optical functional models, prototypes and
Read MoreOptical interconnects for data transmission at board level offer increased energy efficiency, system density, and bandwidth scalability compared to purely copper driven systems. We
Read MorePhotonics functionality in thin glass By changing the perspective from electrical printed circuit board to a photonic solution, the idea of the electro-optical circuit
Read MoreThe manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series.
Read MoreMentioning: 20 - Abstract-Efficient packaging of integrated photonic chips (PIC) on host substrates is essential to fully deploy their potential and to co-integrate electronic chips (EIC). A highperformance
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